- Digital Humidity Sensor
- Online Training Program
- SCORPION® 2 LITE Temperature Data Logger
- Temperature Interface
- Magnetic Temperature Sensor Array
- Specialized Carrier for Endless Conveyor Ovens
- Specialized Carrier for Tray and Grid Conveyor Ovens
- Temp+Airflow Sensor Array
- Pan+Dough Probe
- Bake Cycle S-Curve Analysis
Digital Humidity Sensor
The new SCORPION® 2 Digital Humidity Sensor provides a better way to measure humidity in your oven, proofer, dryer and cooling tunnel. This breakthrough design provides a more accurate and reliable way to measure the absolute moisture content of the thermal environment. The sensor contains a proprietary humidity sampling system with patent pending Anti-Saturation Technology™ that allows measurements in high temperature and very high dew point processes.
Online Training Program
Getting the most out of your SCORPION® 2 Data Logging Measurement System is key to maximizing your investment. The Online Training Program includes 11 training modules with associated printable handouts that walk you through the usage of each device. Numerous supporting documents are also supplied to further clarify specific features.
SCORPION® 2 LITE Temperature Data Logger
Designed as a low-cost alternative to the full featured SCORPION® 2 Data Logger it is intended for the customer who wants to measure temperature only. SCORPION® 2 LITE is compatible with all temperature measurement devices, i.e. Temperature Interface, Product Probe Interface, Temperature Sensor Arrays, Product Probes and Bare Wire Thermocouples. It is also upgradable to the full featured SCORPION® 2 Data Logger.
Temperature Interface
Allows ten external thermocouples to be connected to the SCORPION® 2 Data Logger. These thermocouples can be user supplied Type T with subminiature or standard male connectors. The Temperature Interface also serves as the mounting point for the Magnetic Temperature Sensor Arrays.
Magnetic Temperature Sensor Array
Designed as a low-cost alternative to the conventional Temperature Sensor Array but still provides fixed sensor repeatability for bulk air temperature measurements. It mounts directly to the Temperature Interface device. Up to 10 Magnetic Base Air Temperature Sensors can be placed along a U channel array at user controlled locations.
Bread & Bun Profiling Solutions:
Specialized Carrier for Endless Conveyor Ovens (e.g. Bake Tech)
Tray Style Carrier for SCORPION® 2 Equipment provides easy loading and unloading on endless conveyors. The carrier, with SCORPION® 2, is inserted into the product flow replacing a bread or bun pan. Stainless Steel Magnetic Base Tray 406mm (16″) wide x 356mm (14″) long x 51mm (2″) high accommodates all SCORPION® 2 Equipment.
Specialized Carrier for Tray and Grid Conveyor Ovens (e.g. AMF, Turkington)
Basket Style Carrier for SCORPION® 2 Equipment provides easy loading and unloading on tray and grid conveyors. The carrier, with SCORPION® 2, is inserted into the product flow replacing a bread or bun pan. Stainless Steel Wire Frame Basket 381mm (15″) wide x 635mm (25″) long x 90mm (3.5″) high accommodates all SCORPION® 2 Equipment.
Temp+Airflow Sensor Array
Designed to simultaneously profile temperature and airflow across the width of large tray and grid conveyor ovens. Array contains 9 Temp+Airflow sensors spaced evenly across the length of an aluminum bar.
Pan+Dough Probe
This dual probe unit is placed under the bread or bun dough simultaneously capturing the pan/dough interface temperature and the dough core temperature. The copper spade is pressed against the pan, by the weight of the dough, measuring the critical pan/dough interface temperature. The vertical stainless steel probe penetrates the dough, to a fixed distance from the pan (1" to 3" in 0.25" increments), measuring the dough core temperature used to produce the Bake Cycle S-Curve. The Pan+Dough Probe provides accurate repeatable results unattainable with hand-placed thermocouples. It connects to the Temperature Interface device which can accommodate 5 dual probes.
Bake Cycle S-Curve Analysis
Bakers rely on Bake Cycle S-Curve Analysis to optimize the baking profile. This analysis provides critical insight needed to make adjustments to ingredients, bake time, and zone temperature settings. SCORPION® Software Version 8 (SV8) automatically calculates the three key S-Curve data points: Yeast Kill, Gelatinization and Arrival.
